SMD-928S HOT PLATE FOR BGA/SMD REPLACEMENT
BEST CHOICE FOR BGA REPLACEMENT
Simple, Fast and Reliable Hot Plate
Best choice for BGA Chip Replacement Processing. Combining with fixture, it is simple and fast to replace solder ball on chips within 3 minutes.
Excellent warm effect to BGA chip before formal replacement work.
Built-in advanced plate-type heater: convenient and effective solution for the various soldering and desoldering work on SMD and BGA chips.
Optimum for PC Board preheating, multi-varied small soldering production and general maintenance on small/middle-size PC Board.
PID Precision Temperature Control System
Temperature precision is ¡Ó 1¢J
More accurate and stable temperature display.With timer display unit to obtain the best soldering result.
Outstanding Safety Device: Upper cover offer complete protect users from any heating damage.
BGA REPLACEMENT FIXTURE AND MATERIALS
World No.1 fast and convenient solution for BGA Chip Replacement work.
Can replace various types of BGA, £gBGA, CSP and LLP.
High precision aluminum alloy structure, durable, light and efficient.
Fast and convenient to reflow solder balls on the BGA chips, one cycle only at 30~90 seconds.
BGA PASTE FLUX
Rosin materials designed for ball grid array process (BGA) requiring reflow application.
Can be successfully reflowed in infrared convention or vapor phase systems.
Can be safely left on the PC board after reflow without cleaning.
Lead-Free flux for option.
BGA Solder Ball
High precision circular size. The tolerance of diameter within 0.02 mm.
Solder balls are packed in argon gas for delivery to user.
A wide range of solder balls size and type for option, such as 0.2, 0.3, 0.45, 0.5, 0.6, and 0.76 mm….etc.
Lead-Free Solder Balls for option.