BGA-936USB BGA Rework Station
SMART New Fuzzy Industrial Microprocessor
ACCURATE Different Color Alignment System
EFFICIENCY Ultra Large Preheating Zone
SUPER FINE Automatic Mechanism and Durable Structure
New page to BGA Rework equipments. BGA-936USB is specially designed for R&D and RMA department in computer and communication fields. Not only brings operators working pleasure from soldering and desoldering procedures but also more economical, and higher efficient solution.
With the assistance of Industrial Microprocessor, no more tools and PC needed. Users can directly set up temperature profile, auto-cooling, auto pick-up, and adjust related parameters according to varied condition.
From cell phone to Server PCB, BGA-936USB offers excellent flexibility and performance. Confirmation and support from PCB manufacturers over all the world make us believe BGA-936USB will also be your best choice!
Spec Sheets http://www.smtstore.com/lfb.pdf
New Fuzzy Industrial Microprocessor
New Fuzzy Industrial Microprocessor System with USB Disk Data Storage
PC-based Industry-Level Microprocessor System and LCD panel,bring more accurate and stable operation.
All the parameter and heating process can be recorded without extra PC or equipment connection.
Auto Pick-UP vacuum function makes Reflow / Desoldering of BGA and LLP chips easier.
Design for independent operation. No need additional equipment.
Smart Operation Control System
Easy and Quick to Set up Parameter
All parameter can be directly settled on the LCD panel without using any other facility. Besides, it is equipped with extra removable controller for easy operation.
All soldering parameter can be saved and installed with USB Disk.
Clear Temperature Parameter List
Profile Direct Show-up for 99 sets and unlimited profiles space
Fast check on 99 sets of profile memories : completely solves the profile reset problem caused by the difference of BGA chips. Save operation time and enhance production efficiency.
Unlimited sets of profiles space: Besides fast check function, Operators can install as many as every temperature profile on BGA-936USB via built-in USB Disk Port. “Once used, forever memorized.” is our constant promise to clients.
Excellent Temperature Profile Setting
Included 3 Temperature Detectors
Three Sets of thermocouple can measure the heating characteristic of BGA body and PC Board directly.
Reflow profile can be 100% set up and operator can easily set up parameter with complicated training course in advance.
Chinese and English version for option.
3 Sets of Temperature detectors
Different Color Alignment System
Different Color Alignment System makes Perfect Image
World No.1 Model created Different Color Alignment System (Patent No : 177479)
Special design for CSP (µBGA. Tiny BGA), fine pitch BGA and LLP.
When images of BGA and PC Board overlap, comparison between two images will be very clear.
Automatic Z spindle and Alignment system: Quick and smooth movement, accurate location with aviation industrial precision linear motion guide.
Bright Color Comparison
The coaxial mechanism avoid CSP chips moving
Auto / manual option for Z spindle. Fully enhance soldering efficiency and easy operation.
BGA Alignment procedure and soldering work are proceeded at the same position.
No need to do alignment on the right and reflow on the left side. Completely avoid aligned BGA chips deviation due to movement.
High Precision device for fast BGA chip Location
Completely avoid the position difference caused by manual operation.
Fast, safe, efficient solution. No more solder paste trouble resulted from direct contact with hand.
Best precision even long term continuous usage. No need to adjust X, Y shafts at all.
Best Position by BGA chip Location device (Option)
EFFICIENCY Ultra Large Preheating ZoneSuper Size Preheating Heater with 3 Zones
Rapid desoldering and soldering, increase 50% efficiency.
Preheating area : 360 x 260 mm is able to divided into 3 zones to satisfy the need for different-size PCB.
Preheating zones can be operated synchronously or independently. Completely solve warpage / twist problem caused by uneven / tiny preheating.
Module design : low cost for maintenance and repair.
Ultra Larger Preheating Zone Shorten preheating time and offers sufficient and even preheating to all PCB.
Quick Cooling System Provides high efficiency
Drastically reduce cooling time by 50% than other designs.
Work with electricity and no extra air compressor needed.
Built-in auto cooling system highly increase 50% working efficiency.
Auto Quick Cooling Device System
Increase 50% efficiency.
High Precision LLP Chip Solder Paste-Printing device
Average printing time for one BGA / LLP chip is within 30 seconds.
Able to locate Printing fixture on alignment system directly for perfect alignment effect.
Unified Flux thickness from Solder Paste Printing device provides users the best reflow quality.
Qualify for CE and MIL standard.
Solder Paste Printing Device
Automatic Mechanism and Durable StructureAutomatic Mechanism Save time and manpower
Super Fine Automatic Mechanism
Durable Structure and Modular designed for Easy Maintenance
Durable structure design: Even put 50 kg heavy stuff on either side of PCB clamper, no shake will happen.
Advanced linear motion guide: Not only make working table movement more smoothly but make whole structure more durable.
Durable PCB Clamper Table
Designed for Lead-Free Soldering
Completely solve lead-free rework process strict requirement.
High efficiency Nitrogen reflow system for option.
If any question about Lead-Free Soldering, contact Fonton right now!.