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BGA-936USB BGA Rework Station
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| SMART |
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New Fuzzy Industrial Microprocessor |
| ACCURATE |
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Different Color Alignment System |
| EFFICIENCY |
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Ultra Large Preheating Zone |
| SUPER FINE |
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Automatic Mechanism and Durable Structure |
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New page to BGA Rework equipments. BGA-936USB is specially designed for R&D and RMA department in computer and communication fields. Not only brings operators working pleasure from soldering and desoldering procedures but also more economical, and higher efficient solution.With the assistance of Industrial Microprocessor, no more tools and PC needed. Users can directly set up temperature profile, auto-cooling, auto pick-up, and adjust related parameters according to varied condition.From cell phone to Server PCB, BGA-936USB offers excellent flexibility and performance. Confirmation and support from PCB manufacturers over all the world make us believe BGA-936USB will also be your best choice! |
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Perfect Performance |
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Auto Quick
Cooling Device |
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Fast Chip Feed-in (Option) |
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Auto Chip Pick-up |
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Different Color
Alignment System |
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Auto Reflow |
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¡@¡@ |
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SMART |
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New Fuzzy Industrial Microprocessor |
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New Fuzzy Industrial Microprocessor System with USB Disk Data Storage |
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PC-based Industry-Level Microprocessor System and LCD panel,bring more accurate and stable operation. |
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All the parameter and heating process can be recorded without extra PC or equipment connection. |
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Auto Pick-UP vacuum function makes Reflow / Desoldering of BGA and LLP chips easier. |
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Design for independent operation. No need additional equipment. |
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| Smart Operation Control System |
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Easy and Quick to Set up Parameter |
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All parameter can be directly settled on the LCD panel without using any other facility. Besides, it is equipped with extra removable controller for easy operation. |
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All soldering parameter can be saved and installed with USB Disk. |
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Clear Temperature Parameter List |
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Profile Direct Show-up for 99 sets and unlimited profiles space |
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Fast check on 99 sets of profile memories : completely solves the profile reset problem caused by the difference of BGA chips. Save operation time and enhance production efficiency. |
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Unlimited sets of profiles space: Besides fast check function, Operators can install as many as every temperature profile on BGA-936USB via built-in USB Disk Port. “Once used, forever memorized.” is our constant promise to clients. |
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Excellent Temperature Profile Setting |
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Included 3 Temperature Detectors |
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Three Sets of thermocouple can measure the heating characteristic of BGA body and PC Board directly. |
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Reflow profile can be 100% set up and operator can easily set up parameter with complicated training course in advance. |
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Chinese and English version for option. |
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| 3 Sets of Temperature detectors |
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¡@¡@ |
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ACCURATE |
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Different Color Alignment System |
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Different Color Alignment System makes Perfect Image |
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World No.1 Model created Different Color Alignment System (Patent No : 177479) |
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Special design for CSP (µBGA. Tiny BGA), fine pitch BGA and LLP. |
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When images of BGA and PC Board overlap, comparison between two images will be very clear. |
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Automatic Z spindle and Alignment system: Quick and smooth movement, accurate location with aviation industrial precision linear motion guide. |
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Bright Color Comparison
Simply overlap the red of solder balls and green of pad into one image. |
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The coaxial mechanism avoid CSP chips moving |
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Auto / manual option for Z spindle. Fully enhance soldering efficiency and easy operation. |
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BGA Alignment procedure and soldering work are proceeded at the same position. |
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No need to do alignment on the right and reflow on the left side. Completely avoid aligned BGA chips deviation due to movement. |
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The Best Coaxial Mechanism
Pick up, alignment and reflow at the same position avoid chips moving. |
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High Precision device for fast BGA chip Location |
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Completely avoid the position difference caused by manual operation. |
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Fast, safe, efficient solution. No more solder paste trouble resulted from direct contact with hand. |
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Best precision even long term continuous usage. No need to adjust X, Y shafts at all. |
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Best Position by BGA chip Location device (Option) |
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EFFICIENCY |
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Ultra Large Preheating Zone |
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Super Size Preheating Heater with 3 Zones |
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Rapid desoldering and soldering, increase 50% efficiency. |
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Preheating area : 360 x 260 mm is able to divided into 3 zones to satisfy the need for different-size PCB. |
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Preheating zones can be operated synchronously or independently. Completely solve warpage / twist problem caused by uneven / tiny preheating. |
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Module design : low cost for maintenance and repair. |
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Ultra Larger Preheating Zone
Shorten preheating time and offers sufficient and even preheating to all PCB. |
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Quick Cooling System Provides high efficiency |
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Drastically reduce cooling time by 50% than other designs. |
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Work with electricity and no extra air compressor needed. |
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Built-in auto cooling system highly increase 50% working efficiency. |
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Auto Quick Cooling Device System
Increase 50% efficiency. |
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High Precision LLP Chip Solder Paste-Printing device |
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Average printing time for one BGA / LLP chip is within 30 seconds. |
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Able to locate Printing fixture on alignment system directly for perfect alignment effect. |
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Unified Flux thickness from Solder Paste Printing device provides users the best reflow quality. |
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Qualify for CE and MIL standard. |
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| Solder Paste Printing Device |
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SUPER FINE |
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Automatic Mechanism and Durable Structure |
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Automatic Mechanism Save time and manpower |
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Soldering Head and CCD camera: directly controlled by Microprocessor or soldering head control box aside. |
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User-friendly design: no more damage due to wrong operation in CCD camera system. Alignment system will automatically turn off while soldering head going down. |
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Super Fine Automatic Mechanism |
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Durable Structure and Modular designed for Easy Maintenance |
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Durable structure design: Even put 50 kg heavy stuff on either side of PCB clamper, no shake will happen. |
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Advanced linear motion guide: Not only make working table movement more smoothly but make whole structure more durable. |
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Durable PCB Clamper Table |
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Designed for Lead-Free Soldering |
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Completely solve lead-free rework process strict requirement. |
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High efficiency Nitrogen reflow system for option. |
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If any question about Lead-Free Soldering, contact Fonton right now!. |
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BGA/CSP/LLP
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SOP.QFP
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NO.
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SIZE
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TYPE
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OH
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CH
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| BGA-N001 |
5X5 |
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¡E
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| BGA-N004 |
5X10 |
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¡E
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| BGA-N007 |
10X10 |
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¡E
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| BGA-N010 |
10X15 |
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¡E
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| BGA-N016 |
16X24 |
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¡E
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| BGA-N020 |
29X29 |
¡E |
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| BGA-N024 |
37X37 |
¡E |
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| BGA-N025 |
39X39 |
¡E
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| BGA-N026 |
42X42 |
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¡E
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| BGA-N028 |
45X45 |
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¡E
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| BGA-N061 |
33X33 |
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¡E
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| BGA-OPT10 |
70X70 |
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¡E
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| BGA-OPT43 |
10X12 |
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¡E
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| BGA-OPT55 |
55X66 |
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¡E
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| BGA-OPT57 |
58X48 |
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¡E
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| BGA-OPT58 |
48X41 |
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¡E
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| BGA-OPT70 |
75X75 |
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NO.
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SIZE
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TYPE
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OH
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CH
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BGA-N041
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13X12
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¡E
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BGA-N043
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13X20
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¡E
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BGA-N045
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15X22
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¡E
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BGA-OPT46
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7X7
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¡E
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BGA-N047
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17X30
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¡E |
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BGA-N051
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11X11
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¡E
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BGA-N052
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13X13
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¡E
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BGA-N053
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15X15
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¡E
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BGA-N054
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17X17
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¡E
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BGA-N055
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19X19
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¡E
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BGA-N056
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21X21
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¡E
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BGA-N057
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23X23
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¡E
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BGA-N058
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25X25
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¡E
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BGA-N059
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26X20
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¡E
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BGA-N062
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35X35
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¡E
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SOJ.PLCC
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DIP-PGA
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NO.
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SIZE
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TYPE
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OH
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CH
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BGA-N081
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10X17
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¡E
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BGA-N083
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12X19
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¡E
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BGA-N085
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12X27
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¡E
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BGA-N090
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12X12
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¡E
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BGA-N091
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14X14
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¡E
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BGA-N093
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17X15
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¡E
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BGA-N095
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20X20
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¡E
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BGA-N096
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25X25
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¡E
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BGA-N097
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27X27
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¡E
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BGA-N098
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32X32
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¡E
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BGA-N099
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37X37
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¡E
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NO.
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SIZE
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TYPE
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OH
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CH
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BGA-N121
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10X20
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¡E
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BGA-N122
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10X22.5
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¡E
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BGA-N123
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10X25
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¡E
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BGA-N124
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10X27.5
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¡E
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BGA-N131
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18X32
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¡E
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BGA-N133
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18X37
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¡E
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BGA-N135
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18X42
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¡E
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BGA-N139
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18X52
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¡E
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BGA-N141
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21.5X21.5
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¡E
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BGA-N143
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29X29
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¡E
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BGA-N145
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34X34
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¡E
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BGA-N148
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49X49
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¡E
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REMARKS:
Particular specification fo nozzle can be ordered. Please inform us the BGA specification or nozzle specification, or your part sample |
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