BEST CHOICE FOR BGA REPLACEMENT 

Simple, Fast and Reliable Hot Plate
Best choice for BGA Chip Replacement Processing. Combining with fixture, it is simple and fast to replace solder ball on chips within 3 minutes.

Excellent warm effect to BGA chip before formal replacement work.

Built-in advanced plate-type heater: convenient and effective solution for the various soldering and desoldering work on SMD and BGA chips.

Optimum for PC Board preheating, multi-varied small soldering production and general maintenance on small/middle-size PC Board.

PID Precision Temperature Control System

Temperature precision is ¡Ó 1¢J

More accurate and stable temperature display.With timer display unit to obtain the best soldering result.

Outstanding Safety Device: Upper cover offer complete protect users from any heating damage.

BGA REPLACEMENT FIXTURE AND MATERIALS

REPLACEMENT FIXTURE

World No.1 fast and convenient solution for BGA Chip Replacement work.

Can replace various types of BGA, £gBGA, CSP and LLP.
High precision aluminum alloy structure, durable, light and efficient.

Fast and convenient to reflow solder balls on the BGA chips, one cycle only at 30~90 seconds.

BGA PASTE FLUX

Rosin materials designed for ball grid array process (BGA) requiring reflow application.

Can be successfully reflowed in infrared convention or vapor phase systems.

Can be safely left on the PC board after reflow without cleaning.

Lead-Free flux for option.

BGA Solder Ball

High precision circular size. The tolerance of diameter within 0.02 mm.

Solder balls are packed in argon gas for delivery to user.

A wide range of solder balls size and type for option, such as 0.2, 0.3, 0.45, 0.5, 0.6, and 0.76 mm….etc.

Lead-Free Solder Balls for option.

Easy operation and high performance is what BGA-935BL famous for. Equipped with outstanding nozzles and precise temperature control device, BGA-935BL is popular in RMA departments and Mobile Phone field.

3 minutes setup in microprocessor controller, BGA-935BL will precisely and accurately proceed BGA soldering and desoldering work.

HIGH PERFORMANCE
Powerful Function
Quick Soldering and Protect the Components Safety

Sole design for adjustable hot air forcible guide (Patent No. 156948 & 135016).

Adopt high volume (250 l/min), low pressure (0.22kg/ cm2 ), low temp rework (220¢J), completely guarantee BGA chips electricity and excellent soldering quality.

Utilization of silence pressure type air blower permit the regulation of silent ventilator, the air flow can be regulated to 250 l/Min the maximum.

Hot air multi-hole round center support, especially useful for big-size PCB and BGA located in the center of PCB. Avoid hollow soldering and IC-drop situation.

Temperature profile of bottom hot air heater can reach as high as 300¢J, critical for big size motherboard. Meanwhile, it can setup with upper heater for synchronized work or independent operation.

Utilization of hot air forcible guide, nozzle will match with PC board while heating. Totally uninfluential to other components.

Programmable Temperature Control
System makes Excellent Profile

Built-in itinerary reflow display permit clearly control the reflow condition. With vacuum pump, it can pull out the SMD automatically.

The temperature of hot air is stable and the temperature accurately at ¡Ó 0.1¢J., select as your wish between ¢J and ¢K equipped three groups of PID value, a reference number can be programmed automatically, also can be memorized and stocked.

High speed feedback system, accurate hot air temperature memory.

RS 232 and computer connection for better management.

Built-in programmable fuzzy hot air temperature and time control system permit the best obtaining of soldering profile.

Durable Structure

The three XYZ shafts have the detailed regulation function or can locate quickly. The nozzle can be rotated freely with a range of 360o.

Main structure is an aluminum alloy with heat treatment, linear ball guide and painted with PP powder. Easy maintenance, durable utilization and beautiful appearance.

Anti-static electricity and totally ground wire design. The electricity specification conform MIL, UL, VDE standards.

CCD Camera system for option.

BGA-936USB BGA Rework Station

 

¡@         Auto Quick Cooling Device

Fast Chip Feed-in (Option)         Auto Chip Pick-up         Different Color Alignment System         Auto Reflow

	New Fuzzy Industrial Microprocessor System with USB Disk Data Storage
	PC-based Industry-Level Microprocessor System and LCD panel,bring more accurate and stable operation.   All the parameter and heating process can be recorded without extra PC or equipment connection.   Auto Pick-UP vacuum function makes Reflow / Desoldering of BGA and LLP chips easier.   Design for independent operation. No need additional equipment.   Smart Operation Control System
	Easy and Quick to Set up Parameter
	All parameter can be directly settled on the LCD panel without using any other facility. Besides, it is equipped with extra removable controller for easy operation.   All soldering parameter can be saved and installed with USB Disk.     Clear Temperature Parameter List
	Profile Direct Show-up for 99 sets and unlimited profiles space
	Fast check on 99 sets of profile memories : completely solves the profile reset problem caused by the difference of BGA chips. Save operation time and enhance production efficiency.   Unlimited sets of profiles space: Besides fast check function, Operators can install as many as every temperature profile on BGA-936USB via built-in USB Disk Port. “Once used, forever memorized.” is our constant promise to clients.     Excellent Temperature Profile Setting
	Included 3 Temperature Detectors
	Three Sets of thermocouple can measure the heating characteristic of BGA body and PC Board directly.   Reflow profile can be 100% set up and operator can easily set up parameter with complicated training course in advance.   Chinese and English version for option.   3 Sets of Temperature detectors

	Different Color Alignment System makes Perfect Image
	World No.1 Model created Different Color Alignment System (Patent No : 177479)   Special design for CSP (µBGA. Tiny BGA), fine pitch BGA and LLP.   When images of BGA and PC Board overlap, comparison between two images will be very clear.   Automatic Z spindle and Alignment system: Quick and smooth movement, accurate location with aviation industrial precision linear motion guide.         Bright Color Comparison Simply overlap the red of solder balls and green of pad into one image.
	The coaxial mechanism avoid CSP chips moving
	Auto / manual option for Z spindle. Fully enhance soldering efficiency and easy operation.   BGA Alignment procedure and soldering work are proceeded at the same position.   No need to do alignment on the right and reflow on the left side. Completely avoid aligned BGA chips deviation due to movement.         The Best Coaxial Mechanism Pick up, alignment and reflow at the same position avoid chips moving.
	High Precision device for fast BGA chip Location
	Completely avoid the position difference caused by manual operation.   Fast, safe, efficient solution. No more solder paste trouble resulted from direct contact with hand.   Best precision even long term continuous usage. No need to adjust X, Y shafts at all.         Best Position by BGA chip Location device (Option)

	Super Size Preheating Heater with 3 Zones
	Rapid desoldering and soldering, increase 50% efficiency.   Preheating area : 360 x 260 mm is able to divided into 3 zones to satisfy the need for different-size PCB.   Preheating zones can be operated synchronously or independently. Completely solve warpage / twist problem caused by uneven / tiny preheating.   Module design : low cost for maintenance and repair.         Ultra Larger Preheating Zone Shorten preheating time and offers sufficient and even preheating to all PCB.
	Quick Cooling System Provides high efficiency
	Drastically reduce cooling time by 50% than other designs.   Work with electricity and no extra air compressor needed.   Built-in auto cooling system highly increase 50% working efficiency.         Auto Quick Cooling Device System Increase 50% efficiency.
	High Precision LLP Chip Solder Paste-Printing device
	Average printing time for one BGA / LLP chip is within 30 seconds.   Able to locate Printing fixture on alignment system directly for perfect alignment effect.   Unified Flux thickness from Solder Paste Printing device provides users the best reflow quality.   Qualify for CE and MIL standard.   Solder Paste Printing Device

	Automatic Mechanism Save time and manpower
	Soldering Head and CCD camera: directly controlled by Microprocessor or soldering head control box aside.   User-friendly design: no more damage due to wrong operation in CCD camera system. Alignment system will automatically turn off while soldering head going down.      Super Fine Automatic Mechanism
	Durable Structure and Modular designed for Easy Maintenance
	Durable structure design: Even put 50 kg heavy stuff on either side of PCB clamper, no shake will happen.    Advanced linear motion guide: Not only make working table movement more smoothly but make whole structure more durable.     Durable PCB Clamper Table
	Designed for Lead-Free Soldering
	Completely solve lead-free rework process strict requirement.   High efficiency Nitrogen reflow system for option.   If any question about Lead-Free Soldering, contact Fonton right now!.
	BGA/CSP/LLP SOP.QFP NO. SIZE TYPE OH CH BGA-N001 5X5   ¡E BGA-N004 5X10   ¡E BGA-N007 10X10   ¡E BGA-N010 10X15   ¡E BGA-N016 16X24   ¡E BGA-N020 29X29 ¡E BGA-N024 37X37 ¡E BGA-N025 39X39 ¡E BGA-N026 42X42   ¡E BGA-N028 45X45   ¡E BGA-N061 33X33   ¡E BGA-OPT10 70X70   ¡E BGA-OPT43 10X12   ¡E BGA-OPT55 55X66   ¡E BGA-OPT57 58X48   ¡E BGA-OPT58 48X41   ¡E BGA-OPT70 75X75   ¡E NO. SIZE TYPE OH CH BGA-N041 13X12   ¡E BGA-N043 13X20   ¡E BGA-N045 15X22   ¡E BGA-OPT46 7X7   ¡E BGA-N047 17X30   ¡E BGA-N051 11X11   ¡E BGA-N052 13X13   ¡E BGA-N053 15X15   ¡E BGA-N054 17X17   ¡E BGA-N055 19X19   ¡E BGA-N056 21X21   ¡E BGA-N057 23X23   ¡E BGA-N058 25X25   ¡E BGA-N059 26X20   ¡E BGA-N062 35X35   ¡E
	SOJ.PLCC DIP-PGA NO. SIZE TYPE OH CH BGA-N081 10X17   ¡E BGA-N083 12X19   ¡E BGA-N085 12X27   ¡E BGA-N090 12X12   ¡E BGA-N091 14X14   ¡E BGA-N093 17X15   ¡E BGA-N095 20X20   ¡E BGA-N096 25X25   ¡E BGA-N097 27X27   ¡E BGA-N098 32X32   ¡E BGA-N099 37X37   ¡E         NO. SIZE TYPE OH CH BGA-N121 10X20   ¡E BGA-N122 10X22.5   ¡E BGA-N123 10X25   ¡E BGA-N124 10X27.5   ¡E BGA-N131 18X32   ¡E BGA-N133 18X37   ¡E BGA-N135 18X42   ¡E BGA-N139 18X52   ¡E BGA-N141 21.5X21.5   ¡E BGA-N143 29X29   ¡E BGA-N145 34X34   ¡E BGA-N148 49X49   ¡E
	REMARKS: Particular specification fo nozzle can be ordered. Please inform us the BGA specification or nozzle specification, or your part sample

Powerful and Durable

Super durable vacuum pump made by aluminum alloy offers ET-8501 remarkable vacuum pressure, 620mm Hg, best guarantee to suck tin from PCB and meanwhile keep clean smooth surface. In addition, the sucking gun adapted ceramic heater and tips help tip-desoldering quick and easy.

Power vacuum pump

Which suction can clean and smooth desoldering tin and most suitable for the desoldering operation of multiple P.C. Board, also can avoid effectively the floating and dropping of copper pad as well as the break down of circuits.

Durable Nozzle

The nozzle used the complex alloy metal of special forming and it endures long corroding and friction resistance. Without oxidized. There are wide selections of nozzles for different requirements. Easy and fast for change.

Ceramic Element

Used the up-to date find ceramic heater that it can heat rapidly and distribute temperature evenly to ensure the longest service life and perfect insulation, insulation resistance 120M Up at 500¢J and can protect the precision electronic components with best effect.

Adjustable Temperature Control

Optional choices for temperature according to the differences requirements, with optional setting from 50¢J~500¢J and rapid temperature compensation can be operated continuously to achieve the high efficiency

966ESD Temperature Controlled Soldering Station

Brand-new ergonomics concept and excellent electronics characteristic of 966ESD give soldering iron new image of high tech and 100 % satisfaction.

New electronics characteristics, such as transient voltage suppressor and zero voltage switching, highly upper the safety of components and decrease the damage from wrong operation. In

 addition, there are more than many special tips for option.

Excellent Electronics Characteristic

High insulation, fine ceramic heater with an insulated resistance of over 300M at a temperature 400¢J and excellent isolating transformer 24VAC.

Temperature setting device, to avoid changes of temperature settings by

966ESD

 operators accidentally.

Superior temperature feedback system, to control the temperature variation in the range of ¡Ó1¢J on the conditions that the temperature is stabilized and there is no external loading.

Transient voltage suppressor, to protect electronic circuits.
Zero voltage switching, for reduce power noise interference.

Ergonomics Concept

Light handle, only about 48g in weight, curvilinear fingerstall in the base of ergonomics.

Separate design, easy placement for soldering iron, high safety, no tin spit on the working bench.

Streamline configuration, modularized structure and easy Maintenance

Microprocessor Controlled Soldering Station

Set new standard for high level Soldering Iron. Built-in Micro Control (ASIC) chip design, design of electricity circuit and new Fuzzy temperature controller system makes 968ESD the best in soldering iron.

LCD display, changeable temperature unit, memory for temperature setting, personal temperature password, temperature capability and user-friendly interface are everything that experienced users dream for a soldering iron. Now are all included in the standard specification of Model 968ESD.

New Fuzzy temperature control system

Digital microprocessor controller adopted to avoid temperature overshooting effectively and accurately.

Unit changeable, for two temperature units of ¢J and ¢K.

LCD display panel, automatically showing the values of Sv (temperature setting), PV (real temperature), deviation and temperature accuracy of ¡Ó1¢J.

Memory for temperature setting, constant temperature setting system.

Excellent Function

Auto-diagnosis for trouble-shooting to immediately found out he cause for breakdown.

Password for temperature setting without aids from auxiliary tools

All design advantages in the Model 966ESD are also available.

Environmental protection

Green labels for main parts, easy to classify and recyclable as well as meet the requirements for environmental protection.

Compliance with the safety requirements, such as CE, UL, Mil and etc, availability of general and anti-static models to meet different needs.

Superior temperature feedback system and compensating velocity can reduce the soldering temperature very effectively.
An insulated resistance more than 300M can components from damages caused by leak of electricity.